Last edited by Fenribei
Sunday, July 19, 2020 | History

2 edition of Electrodeposition and analysis of Cu-In alloys found in the catalog.

Electrodeposition and analysis of Cu-In alloys

Dennis Sander

Electrodeposition and analysis of Cu-In alloys

by Dennis Sander

  • 245 Want to read
  • 10 Currently reading

Published by Laurentian University in Sudbury, Ont .
Written in English


Edition Notes

Statementby Dennis Sander.
The Physical Object
Paginationv, 19 l. :
Number of Pages19
ID Numbers
Open LibraryOL22162252M

Copper–indium catalysts have recently shown promising performance for the selective electrochemical reduction of CO2 to CO. In this work, we prepared Cu–In nanoalloys by the in situ reduction of CuInO2 and In2O3-supported Cu nanoparticles and found that the structure of these nanoalloys evolves substantially over several electrocatalytic cycles, in parallel with an Cited by: electrodeposition p. 34 Quantitative monitoring of copper electroplating additives and their breakdown products p. 41 Influence of leveling agents on surface roughness of electrodeposited copper films p. 57 An in situ spectroelectrochemical investigation into the electrodeposition of Cu.

@article{osti_, title = {Multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates.}, author = {Chen, Ken Shuang}, abstractNote = {This report documents the author's efforts in the deterministic modeling of copper-sulfidation corrosion on non-planar substrates such as diodes and electrical connectors. Nanoparticle-based, solution-processed chalcopyrite photovoltaic devices have drawn tremendous attraction for the realization of low-cost, large-area solar cell applications. In particular, it has been recently demonstrated that the CuSe phase plays a critical role in allowing the formation of device-quality, nanoparticle-based chalcopyrite absorber by: 9.

Theory and Experiment of Chalcogenide Materials ( pp.) Directors of Dissertation: David A. Drabold and Gang Chen In this dissertation, we present the experimental and theoretical investigation of extensive properties of chalcogenide materials and their potential application in solid electrolytes and phase change memory materials. materials. He has (co) authored over 70 publications, three book chapters, and holds three patents. WG 1 V. Kostov, I. Krastev and Ts. Dobrovolska Electrodeposition of Copper‐Antimony Alloys The establishments of the conditions of the electrodeposition of structured and.


Share this book
You might also like
Rosie.

Rosie.

Calculus Connections

Calculus Connections

Older Floridians handbook

Older Floridians handbook

Watchers, The

Watchers, The

Housing management, consumers and citizens

Housing management, consumers and citizens

Treasury of Christmas Crafts/3 Books in 1

Treasury of Christmas Crafts/3 Books in 1

The amygdala

The amygdala

Tadpole diary.

Tadpole diary.

New discoveries in Babylonia about Genesis.

New discoveries in Babylonia about Genesis.

To reauthorize the Hate Crime Statistics Act

To reauthorize the Hate Crime Statistics Act

Dad On The Job (Fabulous Fathers, Handyman, Inc.)

Dad On The Job (Fabulous Fathers, Handyman, Inc.)

Farhang i Rashīdī

Farhang i Rashīdī

education of engineering designers.

education of engineering designers.

Vaughans book for florists

Vaughans book for florists

Forestry.

Forestry.

Electrodeposition and analysis of Cu-In alloys by Dennis Sander Download PDF EPUB FB2

Effects of Ultrasonics on Electrodeposition of Copper Alloys from Cyanide Electrolytes,United States Department of the Interior, Bureau of Mines, USBM Report of Investigations, RI by Kenahan, C. et al. and a great selection of related books, art and collectibles available now at (a) XRD patterns of the Au-Cu alloys electrodeposited at the J p varied from 5 to 20 mA/cm 2 with t on and t off both fixed at 10 ms.

The straight dash line indicates the center of ( Composition (x In) of Cu-In alloys deposited on molybdenum substrate from an electrolyte containing mM Cu 2 + and M In 3 + at room temperature and 50 C.

Advertisement Content uploaded by. The electrodeposition of Zn, Cu, and Zn-Cu alloys for corrosion-resistant coatings and electrochemical applications such as electrocatalysis and electronic devices has received considerable attention in recent years [1–7].The electrodeposition of Zn, Cu, and Zn-Cu alloys is commonly performed in aqueous electrolyte : Xingli Zou, Xionggang Lu, Xueliang Xie.

A wide range of processing approaches employing electrodeposition have been explored for CIGS film formation during the last two decades (Lincot et al., ).These approaches include: (i) electrodeposition of thin Cu and In layers forming a Cu/In precursor stack and reacting this metallic stack with gaseous Se species to form the compound (Tarrant et al., ); (ii).

INTRODUCTION. The electrodeposition of high-tungsten-content alloys has been a subject of considerable interest for the past few decades because of their unique combination of tribo-mechanical, chemical and magnetic properties.The fact that tungsten cannot be electrodeposited from aqueous solutions by other way than co-deposition with such metals as Cited by: 1.

Tin–indium alloys represent attractive lead-free solder candidates. They show lower values of melting point than pure indium, so that they are investigated as materials with significant applications potential in the electronic industry. Electrodeposition is a very convenient route to prepare Sn–In alloys.

The paper presents several experimental results regarding the Author: Liana Anicai, Aurora Petica, Stefania Costovici, Calin Moise, Oana Brincoveanu, Teodor Visan.

Fe-Ni alloys were fabricated on steel substrates by means of pulse electrodeposition in sulfate solutions. The layers were electrodeposited using different peak current densities, duty cycles and frequencies.

Fe contents, microhardnesses and crystalline phases were examined systematically. The. Deep eutectic solvents constitute a class of compounds sharing many similarities with properly named ionic liquids. The accepted definition of ionic liquid is a fluid (liquid for TCited by: 8.

Cu(In, Al)Se2 thin films were prepared by electrodeposition from the aqueous solution consisting of CuCl2, InCl3, AlCl3 and SeO2 onto ITO coated glass substrates.

The as-deposited films were annealed under vacuum for 30 min at temperature ranging between °C and °C. The structural, composition, morphology, optical band gap and electrical resistivity of elaborated Author: Omar Meglali, Nadhir Attaf, Assia Bouraiou, Mohamed Salah Aida.

Dissolution with % v/v HNO 3 plus % v/v H 2 SO 4, followed by separation of the Cu by electrodeposition. The methods were applied for the analysis of standard copper solutions, using calibration against aqueous solutions with or without the addition of Cu.

Electrodepositon of Ga film is very challenging due to the high standard reduction potential (− V vs SHE for Ga3+). In this study, Ga film with compact structure was successfully deposited on the Mo/Cu/In substrate by the pulse current electrodeposition (PCE) method using GaCl3 aqueous solution.

A high deposition rate of Ga3+ and H+ can be achieved by applying a large Cited by: 8. in the book ’Modern Electroplating’ by (Schlesinger and Paunovic, ). According to Brenner () noted that Cu-Pb alloy coatings have been deposited from both simple and complex ions typically in acid and alkaline baths respectively.

The electrodeposition of copper-lead alloys has received little attention. Main Journal of Electroanalytical Chemistry A preliminary study of the electro-catalytic reduction of oxygen on Cu–Pd alloys in alkaline solution Journal.

However, electrodeposition was another method used to deposit the CIS and CIGS films in a non-vacuum atmosphere [9,10,11]. Chang et al. synthesized CIS films by electrodepositing Cu-In-Se precursors using a two-step annealing process.

They used a thermal process treating Cu-In precursors to form uniform Cu 11 In 9 binary : Jing Liu, Kuo-Wei Liu, Mau-Phon Houng, Cheng-Fu Yang.

Though there are a lot of reports on electrochemical lithiation of Si to form amorphous Li-Si all32 or crystalline Li 15 Si 4 5,6, there have been a limited number of publications on the Cited by: USB2 US14/, USA USB2 US B2 US B2 US B2 US A US A US A US B2 US B2 US B2 Authority US United States Prior art keywords vinyl pyridine polymer cu method reacting Prior art date Legal status (The legal status is an Cited by: Cu 2 ZnSnSe 4 (CZTSe) thin films are prepared by the electrodeposition of stack copper/tin/zinc (Cu/Sn/Zn) precursors, followed by selenization with a tin source at a substrate temperature of °C.

Three selenization processes were performed herein to study the effects of the source of tin on the quality of CZTSe thin films that are formed at low Se by:   Engelken RD, Berry AK, Van Doren TP, Boone JL, Shahnazary A () Electrodeposition and analysis of tin selenide films J Electrochem Soc – Google Scholar Lukinskas A, Jasulaitiene V, Lukinskas P, Savickaja I, Kalinauskas P () Electrochemical formation of nanometric layers of tin selenides on Ti by: 1.

Cu2ZnSnSe4 (CZTSe) thin films are prepared by the electrodeposition of stack copper/tin/zinc (Cu/Sn/Zn) precursors, followed by selenization with a tin source at a substrate temperature of °C. Three selenization processes were performed herein to study the effects of the source of tin on the quality of CZTSe thin films that are formed at low Se by:.

Nickel and nickel compounds were considered by previous IARC Working Groups, in,and (IARC, ). Since that time, new data have become available, and these are included in the present monograph and have been taken into consideration in the evaluation. Electrodeposition, otherwise known as electroplating, is a well-known industrial process for extraction, purification, and coating of metals for centuries.

It was not until the late s that the.USB2 US10/, USA USB2 US B2 US B2 US B2 US A US A US A US B2 US B2 US B2 Authority US United States Prior art keywords cu polymer compound substituted pyridyl method superfilling Prior art date Legal status (The legal status is an Cited by: